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IQC (Incoming Quality Control) has to be carried out on each batch of PCBs even though they are fabricated under one roof.we perform it to ensure the high quality of PCBs.
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The purpose of a PCBA first article inspection is to provide evidence that all design and specification requirements are exhaustively verified and recorded.
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High-speed fully automatic patch machine equipped with SPI solder paste detector is an advanced surface mount equipment that can achieve high-speed, high-precision patch operations and is equipped with SPI (Solder Paste ···
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The BGA professional rework machine is a special equipment used to repair BGA chips (ball array packaging). BGA chips are a high-density packaging technology commonly used on motherboards of electronic devices.
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X-ray checking, also known as X-ray inspection or X-ray testing, is a non-destructive testing method commonly used to assess the quality of printed circuit board assemblies (PCBAs).
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The principle of PCBA reflow soldering is a commonly used surface mounting technique for soldering electronic components to printed circuit boards (PCBs).
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