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The BGA professional rework machine is a special equipment used to repair BGA chips (ball array packaging). BGA chips are a high-density packaging technology commonly used on motherboards of electronic devices.
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X-ray checking, also known as X-ray inspection or X-ray testing, is a non-destructive testing method commonly used to assess the quality of printed circuit board assemblies (PCBAs).
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The principle of PCBA reflow soldering is a commonly used surface mounting technique for soldering electronic components to printed circuit boards (PCBs).
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PCBA AOI inspection (Printed Circuit Assembly Automated Optical Inspection) is an efficient and accurate automated inspection process used to verify the quality and consistency of the circuit board assembly process.
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Manual visual testing is to confirm the installation of components on the PCB through human vision and comparison, and this technology is one of the most widely used online testing methods. Low upfront cost and no test f···
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For PCB manufacturers, there are plenty of choices worldwide. However, not all PCB manufacturers are the same. Quality, reliability, and cost-effectiveness are some of the key factors to consider when evaluating the best···
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